Features
Solving the Challenges of Increasing Power Density By Reducing Number of Power Rails - March 2023
By Andy Wang, Business Line Director, High-Voltage Power Business Unit Allegro MicroSystems
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe News
December 30, 2021
Transfer Multisort Elektronik (TME) has added 15 SPSCAP products to its supercapacitor portfolio...
The ePower chipset is a 100V GaN driver and an eGaN FET which can be up to 65A for high density, small form factor designs...
December 28, 2021
The space required for a Class D audio amplifier is reduced by 36% when using the MAX25203, says Analog Devices...
December 13, 2021
Monolithic Integration of Schottky Diodes and Depletion-Mode HEMTs with 200 V GaN-IC shown by IMEC at IEDM 2021 will boost the performance of GaN power systems...
December 9, 2021
SiC MOSFETs and digital gate drivers from Microchip are used in Mersen’s SiC Power Stack for e-mobility and energy storage...
December 8, 2021
InnoSwitch3-TN off-line, CV/CC flyback switcher ICs are offered in a safety-qualified, compact MinSOP-16A package...
December 8, 2021
Microchip and Mersen Collaborate on Silicon Carbide Power Systems for industrial applications ...
December 7, 2021
The 24-bit ADS127L11 maximises channel density and battery life for data acquisition, says the company...
December 6, 2021
The high temperature inductor delivers low DCR and high current filtering is in a 2525 case for multi-phase power supplies...
December 3, 2021
The latest addition to Recom’s DC/DC converter portfolio, is the RSH2, which features 2W output and a surface mount format...
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