Features
Edge Computing Leverages Modular Power in Scalable Micro Data Centres - May 2022
Edge computing is essential to realizing the full potential of artificial intelligence (AI), machine learning and internet of things (IoT). These technologies are being infused into every corner of...
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Power Electronics Europe News
KONNEKT high density packaging has been introduced to the KC-LINK range of capacitors for WBG and wireless charging designs....
Toshiba Electronics Europe says the TPD4162F is for any applications with input signals from 200 to 220V AC....
Silicon Germanium (SiGe) AEC-Q1010-approved rectifiers from Nexperia combine Schottky and fast recovery characteristics....
The company has launched the 1700V surface mount devices based on its proprietary trench semiconductor technology. ...
May 29, 2020
TDK-Lambda has introduced the 300W non-isolated devices with adjustable output for demanding applications....
Automotive-grade thin film resistors in the TNPU e3 series are designed for increased accuracy, says Vishay Intertechnology....
May 27, 2020
Taiwan Semiconductor says its wettable flank contact package enables higher power density and a high maximum current....
Alpha and Omega Semiconductor has launched the AOK065V120X2, the initial device in a series of silicon carbide (SiC) MOSFETs....
May 11, 2020
Compact devices from Littelfuse protect mobile and portable appliances and electronic devices....
May 10, 2020
Compact devices from Littelfuse protect mobile and portable appliances and electronic devices....
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